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  • Marie Jay's Metal Products Co., Ltd

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Marie Jay's Metal Products Co., Ltd

Home > Industry Information > Pure Tungsten Carbide Sputtering Target
Industry Information

Pure Tungsten Carbide Sputtering Target

2019-05-11

The requirements for sputtering targets are higher than those of traditional materials. General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size and defect control; higher requirements or special requirements Requirements include: surface roughness, resistance, grain size uniformity, composition and tissue uniformity, foreign matter (oxide) content and size, magnetic permeability, ultra-high density and ultra-fine grains. Magnetron sputtering coating is a new type of physical vapor deposition method, which uses an electron gun system to emit and focus electrons on the material to be plated, so that the sputtered atoms follow the momentum conversion principle to remove the material with higher kinetic energy. Fly to the substrate to deposit a film. This plated material is called a sputtering target. The sputtering target has metals, alloys, ceramics, borides, and the like.


Main application:

Sputtering targets are mainly used in electronics and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memories, electronic control devices, etc.; they can also be used in the field of glass coating; they can also be applied to wear-resistant materials, high temperature corrosion resistance. , high-end decorative supplies and other industries.


Target classification:

According to the shape, it can be divided into long target, square target, round target, and special target.
According to the composition, it can be divided into metal target, alloy target, and ceramic compound target.
According to different applications, it is divided into semiconductor-related ceramic targets, recording medium ceramic targets, display ceramic targets, superconducting ceramic targets, giant magnetoresistance ceramic targets, etc.
According to the application field, it is divided into microelectronic target, magnetic recording target, optical disk target, precious metal target, thin film resistive target, conductive film target, surface modified target, mask layer target, decorative layer target, Electrode target, package target, other target.

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